Power Semiconductors

CoolMOS™ in ThinkPAK 8x8

Electrical switching behaviour - a low inductive package shows lower ringing at the gate and results in a smooth switching waveform

We recently introduced ThinkPAK 8x8, a new leadless SMD package for high-volt MOSFETs. The new package has a very small footprint of only 64mm² and a very low profile of only 1mm. The signigicantly smaller package in combination with benchmark low parasitic inducatance paves the way for new reductions in solution size, ideal for applications driven by power density considerations.

The ThinkPAK 8x8 package is characterized by a very low source inductance (2n), a separate driver source connection (clean gate signal) as well as thermal performance similar to D²PAK. The package thus enables faster and more efficient switching of power MOSFETs and is easier to handle in terms of switching behaviour and EMI.

Small footprint (8x8mm2) Low profile (1mm) Low parasitic inductance Separate driver source pin RoHS compliance Halogen-free mold compound

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