High Power

SmartPIM and SmartPACK Power Modules Use Self-Acting PressFIT Assembly

Self-acting PressFIT assembly in action. A Smart module is attached to the PCB and to the heatsink in a single-step mounting process using one screw only.

Infineon's new Smart modules are designed for more cost-effective and compact inverter designs by simplifying the mounting process and increasing reliability. The Smart modules combine PressFIT technology with a sophisticated housing concept.

Their new duplex frames achieve a very high level of reliability during the mounting process and subsequent operation. The PressFIT pin is connected to the PCB, the PCB is stabilized and the module is mounted on the heatsink in one single step.

The Smart1 package supports current ratings up to 75 A in Pack and 35 A in PIM configurations at 600 V and 1200 V.

With their self-acting PressFIT assembly and the benefits of PressFIT technology, these new-generation Smart modules raise the bar for cost-efficient designs.

Press-in process by tightening the module Robust housing concept with decoupled DCB makes cracks almost impossible Flexible mounting possibilities Reduced process time Gas-tight and reliable PressFIT connections suitable for sense signals Decreased FIT rates

Industrial drives Uninterruptible power supplies (UPS) Solar inverters Aircon systems Welding systems Inductive heating systems